Package with UBM and methods of forming

ABSTRACT

Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes an integrated circuit die, an encapsulant at least laterally encapsulating the integrated circuit die, a redistribution structure on the integrated circuit die and the encapsulant, a connector support metallization coupled to the redistribution structure, and an external connector on the connector support metallization. The redistribution structure includes a dielectric layer disposed distally from the encapsulant and the integrated circuit die. The connector support metallization has a first portion on a surface of the dielectric layer and has a second portion extending in an opening through the dielectric layer. The first portion of the connector support metallization has a sloped sidewall extending in a direction away from the surface of the dielectric layer.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims priority to and the benefit of U.S. ProvisionalApplication No. 62/050,550, filed on Sep. 15, 2014, entitled “UBM MetalProfile for Reliability Improvement,” which application is herebyincorporated herein by reference in its entirety.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductive layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.Dozens or hundreds of integrated circuits are typically manufactured ona single semiconductor wafer. The individual dies are singulated bysawing the integrated circuits along a scribe line. The individual diesare then packaged separately, such as individually or in multi-chipmodules, or in other types of packaging, for example.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. These smallerelectronic components such as integrated circuit dies may also requiresmaller packages that utilize less area than packages of the past, insome applications.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 14 are cross-sectional views of intermediate stepsduring a process for forming a package structure in accordance with someembodiments.

FIG. 15 is a cross-sectional view of a package structure in accordancewith some embodiments.

FIG. 16 is a cross-sectional view of a package structure in accordancewith some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments discussed herein may be discussed in a specific context,namely a package structure with a fan-out or fan-in wafer-level package.Other embodiments contemplate other applications, such as differentpackage types or different configurations that would be readily apparentto a person of ordinary skill in the art upon reading this disclosure.It should be noted that embodiments discussed herein may not necessarilyillustrate every component or feature that may be present in astructure. For example, multiples of a component may be omitted from afigure, such as when discussion of one of the component may besufficient to convey aspects of the embodiment. Further, methodembodiments discussed herein may be discussed as being performed in aparticular order; however, other method embodiments may be performed inany logical order.

FIGS. 1 through 14 illustrate cross-sectional views of intermediatesteps during a process for forming a package structure in accordancewith some embodiments. FIG. 1 illustrates a carrier substrate 20 and arelease layer 22 formed on the carrier substrate 20. The carriersubstrate 20 may be a glass carrier substrate, a ceramic carriersubstrate, or the like. The carrier substrate 20 may be a wafer. Therelease layer 22 may be formed of a polymer-based material, which may beremoved along with the carrier substrate 20 from the overlyingstructures that will be formed in subsequent steps. In some embodiments,the release layer 22 is an epoxy-based thermal-release material, whichloses its adhesive property when heated, such as aLight-to-Heat-Conversion (LTHC) release coating. In other embodiments,the release layer 22 may be an ultra-violet (UV) glue, which loses itsadhesive property when exposed to UV lights. The release layer 22 may bedispensed as a liquid and cured, may be a laminate film laminated ontothe carrier substrate 20, or may be the like. An adhesive 24 can beformed or dispensed on the release layer 22. The adhesive 24 can be adie attach film (DAF), a glue, a polymer material, or the like.

Integrated circuit die 26 is adhered to the carrier substrate 20 (e.g.,through the release layer 22) by the adhesive 24. As illustrated, oneintegrated circuit die 26 is adhered, and in other embodiments, moreintegrated circuit dies may be adhered. Before being adhered to thecarrier substrate 20, the integrated circuit die 26 may be processedaccording to applicable manufacturing processes to form an integratedcircuit in the integrated circuit die 26. For example, the integratedcircuit die 26 comprises a bulk semiconductor substrate, asemiconductor-on-insulator (SOI) substrate, multi-layered or gradientsubstrates, or the like. The semiconductor of the substrate may includeany semiconductor material, such as elemental semiconductor likesilicon, germanium, or the like; a compound or alloy semiconductorincluding SiC, GaAs, GaP, InP, InAs, indium antimonide, SiGe, GaAsP,AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; the like; or combinationsthereof. Devices, such as transistors, diodes, capacitors, resistors,etc., may be formed in and/or on the semiconductor substrate and may beinterconnected by interconnect structures formed by, for example,metallization patterns in one or more dielectric layers on thesemiconductor substrate to form an integrated circuit.

The integrated circuit die 26 further comprises pads 28, such asaluminum pads, to which external connections are made. The pads 28 areon what may be referred to as an active side of the integrated circuitdie 26. A passivation film 30 is on the integrated circuit die 26 and onportions of the pads 28. Openings are through the passivation film 30 tothe pads 28. Die connectors 32, such as conductive pillars (for example,comprising a metal such as copper), are in the openings throughpassivation film 30 and are mechanically and electrically coupled to therespective pads 28. The die connectors 32 may be formed by, for example,plating or the like. The die connectors 32 electrically couple theintegrated circuit of the integrate circuit die 26. One pad 28 and onedie connector 32 are illustrated on the integrated circuit die 26 forclarity and simplicity, and one of ordinary skill in the art willreadily understand that more than one pad 28 and more than one dieconnector 32 may be present.

A dielectric material 34 is on the active side of the integrated circuitdie 26, such as on the passivation film 30 and the die connectors 32.The dielectric material 34 laterally encapsulates the die connectors 32,and the dielectric material 34 is laterally co-terminus with theintegrated circuit die 26. The dielectric material 34 may be a polymer,such as polybenzoxazole (PBO), polyimide, benzocyclobutene (BCB), or thelike. In other embodiments, the dielectric material 34 is formed of anitride such as silicon nitride; an oxide such as silicon oxide,PhosphoSilicate Glass (PSG), BoroSilicate Glass (BSG), Boron-dopedPhosphoSilicate Glass (BPSG), or the like; or the like. The dielectricmaterial 34 may be formed by any acceptable deposition process, such asspin coating, chemical vapor deposition (CVD), laminating, the like, ora combination thereof. The integrated circuit die 26 may be singulated,such as by sawing or dicing, and adhered to the carrier substrate 20 bythe adhesive 24 using, for example, a pick-and-place tool.

In FIG. 2, an encapsulant 36 is formed on the adhesive 24 around theintegrated circuit die 26 and/or on the various components on theintegrated circuit die 26. The encapsulant 36 may be a molding compound,epoxy, or the like, and may be applied by compression molding, transfermolding, or the like. After curing, the encapsulant 36 can undergo agrinding process to expose the die connectors 32. Top surfaces of thedie connectors 32, dielectric material 34, and encapsulant 36 areco-planar after the grinding process. In some embodiments, the grindingmay be omitted, for example, if the die connectors 32 are alreadyexposed.

In FIG. 3, a first dielectric layer 38 and first metallization pattern40 of a redistribution structure are formed. FIG. 3 and figures thatfollow illustrate an example configuration of the redistributionstructure, and in other embodiments, the redistribution structure cancomprise any number of dielectric layers, metallization patterns, andvias, such as shown in FIGS. 15 and 16.

The first dielectric layer 38 is formed on the encapsulant 36, thedielectric material 34, and the die connectors 32. In some embodiments,the first dielectric layer 38 is formed of a polymer, which may be aphoto-sensitive material such as PBO, polyimide, BCB, or the like, thatmay be easily patterned using a lithography mask. In other embodiments,the first dielectric layer 38 is formed of a nitride such as siliconnitride; an oxide such as silicon oxide, PSG, BSG, BPSG; or the like.The first dielectric layer 38 may be formed by spin coating, lamination,CVD, the like, or a combination thereof. The first dielectric layer 38is then patterned to form openings to expose portions of the dieconnectors 32. The patterning may be by an acceptable process, such asby exposing the first dielectric layer 38 to light when the dielectriclayer is a photo-sensitive material or by etching using, for example, ananisotropic etch.

The first metallization pattern 40 with vias 42 is formed on the firstdielectric layer 38. As an example to form the first metallizationpattern 40 and vias 42, a seed layer (not shown) is formed over thefirst dielectric layer 38. In some embodiments, the seed layer is ametal layer, which may be a single layer or a composite layer comprisinga plurality of sub-layers formed of different materials. In someembodiments, the seed layer comprises a titanium layer and a copperlayer over the titanium layer. The seed layer may be formed using, forexample, Physical Vapor Deposition (PVD) or the like. A photo resist isthen formed and patterned on the seed layer. The photo resist may beformed by spin coating or the like and may be exposed to light forpatterning. The pattern of the photo resist corresponds to the firstmetallization pattern 40. The patterning forms openings through thephoto resist to expose the seed layer. A conductive material is formedin the openings of the photo resist and on the exposed portions of theseed layer. The conductive material may be formed by plating, such aselectroplating or electroless plating, or the like. The conductivematerial may comprise a metal, like copper, titanium, tungsten,aluminum, or the like. Then, the photo resist and portions of the seedlayer on which the conductive material is not formed are removed. Thephoto resist may be removed by an acceptable ashing or strippingprocess, such as using an oxygen plasma or the like. Once the photoresist is removed, exposed portions of the seed layer are removed, suchas by using an acceptable etching process, such as by wet or dryetching. The remaining portions of the seed layer and conductivematerial form the first metallization pattern 40 and vias 42. The vias42 are formed in openings through the underlying layer, e.g., the firstdielectric layer 38.

One or more additional metallization patterns with vias and dielectriclayers may be formed in the redistribution structure by repeating theprocesses for forming the first dielectric layer 38 and the firstmetallization pattern 40. The vias may be formed during the formation ofa metallization pattern as discussed. The vias may thereforeinterconnect and electrically couple the various metallization patterns.The depiction of one dielectric layer, e.g., the first dielectric layer38, and one metallization pattern, e.g., the first metallization pattern40, is for ease and simplicity of illustration.

In FIG. 4, a second dielectric layer 44 is formed on the firstmetallization pattern 40 and the first dielectric layer 38. In someembodiments, the second dielectric layer 44 is formed of a polymer,which may be a photo-sensitive material such as PBO, polyimide, BCB, orthe like, that may be easily patterned using a lithography mask. Inother embodiments, the second dielectric layer 44 is formed of a nitridesuch as silicon nitride; an oxide such as silicon oxide, PSG, BSG, BPSG;or the like. The second dielectric layer 44 may be formed by spincoating, lamination, CVD, the like, or a combination thereof. The seconddielectric layer 44 is then patterned to form openings 46 to exposeportions of the first metallization pattern 40. The patterning may be byan acceptable process, such as by exposing the second dielectric layer44 to light when the dielectric layer is a photo-sensitive material orby etching using, for example, an anisotropic etch.

FIGS. 5 through 13 illustrate formation of Under Ball Metallizations(UBMs) 56 and external electrical connectors 66 on respective ones ofthe UBMs 56. In FIG. 5, a seed layer 48 is formed over the seconddielectric layer 44 and in the opening 46, e.g., on sidewalls of thesecond dielectric layer 44 and on the first metallization pattern 40. Insome embodiments, the seed layer 48 is a metal layer, which may be asingle layer or a composite layer comprising a plurality of sub-layersformed of different materials. In some embodiments, the seed layer 48comprises a titanium layer and a copper layer over the titanium layer.The seed layer 48 may be formed using, for example, PVD or the like.

In FIG. 6, a photo resist 50 is then formed on the seed layer 48. Inthis embodiment, the photo resist 50 is a negative tone photo resistmaterial. The photo resist 50 may be formed on the seed layer by spincoating or the like.

In FIG. 7, the photo resist 50 is patterned on the seed layer 48. Thephoto resist 50 may be exposed to light and subsequently developed forpatterning. Using a negative tone photo resist, portions of the photoresist 50 that are exposed to the light remain after the patterning.After the exposure to light, the photo resist 50 is developed to removesoluble portions of the photo resist 50 such that the non-solubleportions of the photo resist 50 remain on the seed layer 48 withopenings 52 through the photo resist 50. The openings 52 can have slopedsidewalls 54, e.g., sidewalls that are not perpendicular to a majorsurface underlying the photo resist 50 such as of the seed layer 48and/or the second dielectric layer 44. As depicted, the sloped sidewalls54 slope inwardly toward the opening in a direction extending away fromthe underlying major surface. Respective angles θ of the slopedsidewalls 54 with the immediately underlying surface in the openings 52are less than 90°, such as between about 60° and about 85°. The patternof the photo resist 50 corresponds to the UBMs 56 or other metallizationpatterns that will be formed.

In FIG. 8, UBMs 56 and upper metallization pattern 58 are formed inrespective openings 52 of the photo resist 50 and on the seed layer 48.A conductive material is formed in the openings 52 of the photo resist50 and on the exposed portions of the seed layer 48, such as by plating,such as electroplating or electroless plating, or the like. Theconductive material may comprise a metal, like copper, titanium,tungsten, aluminum, or the like. The UBMs 56 and upper metallizationpattern 58 can also have sloped sidewalls that correspond to the slopedsidewalls 54 of the photo resist 50. Hence, angles formed by thesidewalls of the UBMs 56 and upper metallization pattern 58 with theunderlying major surface may be less than 90°, such as between about 60°and about 85°.

Then, in FIG. 9, the photo resist 50 is removed. The photo resist may beremoved by an acceptable ashing or stripping process, such as using anoxygen plasma or the like. In FIG. 10, portions of the seed layer 48 onwhich the conductive material is not formed are removed. The exposedportions of the seed layer 48 are removed, for example, by using anacceptable etching process, such as by wet or dry etching. The remainingportions of the seed layer 48 and conductive material form the UBMs 56and upper metallization pattern 58. As depicted the UBMs 56, with theircorresponding portions of the seed layer 48, are formed in the openings46 through the second dielectric layer 44 and are on the firstmetallization pattern 40. Hence, the UBMs 56 can be electrically coupledto the first metallization pattern 40.

In FIG. 11, an adhesion layer 60 is formed on exterior surfaces of theUBMs 56 and upper metallization pattern 58. The adhesion layer 60 can bean oxide. For example, when the UBMs 56 and upper metallization pattern58 comprise copper, the adhesion layer 60 can comprise copper oxide. Theadhesion layer 60 can be formed by using an acceptable treatment, suchas an oxidation treatment or the like. In some embodiments, the surfacesof the UBMs 56 and upper metallization pattern 58 can be exposed to aplasma containing an oxygen species, for example, an oxygen (O₂) plasma,an ozone (O₃) plasma, a combination of an inert gas and anoxygen-containing gas such as a combination of nitrogen (N₂) and oxygen(O₂), or the like. Other treatments may be used, and other adhesionlayers may be formed.

In FIG. 12, a third dielectric layer 62 is formed on the UBMs 56, uppermetallization pattern 58, and the second dielectric layer 44. In someembodiments, the third dielectric layer 62 is formed of a polymer, whichmay be a photo-sensitive material such as PBO, polyimide, BCB, or thelike, that may be easily patterned using a lithography mask. In otherembodiments, the third dielectric layer 62 is formed of a nitride suchas silicon nitride; an oxide such as silicon oxide, PSG, BSG, BPSG; orthe like. The third dielectric layer 62 may be formed by spin coating,lamination, CVD, the like, or a combination thereof. The thirddielectric layer 62 is then patterned to form openings 64 to exposeportions of the UBMs 56 and/or of the adhesion layer 60 on the UBMs 56.The patterning may be by an acceptable process, such as by exposing thethird dielectric layer 62 to light when the dielectric layer is aphoto-sensitive material or by etching using, for example, ananisotropic etch.

In FIG. 13, portions of the adhesion layer 60 exposed through openings64 are removed, and external electrical connectors 66 are formed on theUBMs 56 through the openings 64. In some embodiments, the exposedportions of the adhesion layer 60 are removed when the externalelectrical connectors 66 are formed, for example, by a flux during aball mount process. In some embodiments, the external electricalconnectors 66 can include low-temperature reflowable material, such assolder, such as a lead-free solder, formed on the UBMs 56 using anacceptable ball drop process. In some embodiments, the externalelectrical connectors 66 are ball grid array (BGA) balls, controlledcollapse chip connection (C4) bumps, microbumps, or the like. Inadditional embodiments, the external electrical connectors 66 caninclude metal pillars.

In FIG. 14, a carrier substrate de-bonding is performed to detach(de-bond) carrier substrate 20 from the package structure. In accordancewith some embodiments, the de-bonding includes projecting a light suchas a laser light or an UV light on release layer 22 so that releaselayer 22 decomposes under the heat of the light and carrier substrate 20can be removed.

Although not depicted, the structure can then be flipped over and placedon a tape and singulated. One of ordinary skill in the art willunderstand that many such package structures may be simultaneouslyformed on the carrier substrate 20, and hence, individual packages, suchas depicted in FIG. 14, can be singulated from the other packages, suchas by sawing or dicing.

FIG. 15 illustrates another cross-sectional view of a package structurein accordance with some embodiments. In the embodiment depicted in FIG.15, the redistribution structure comprises an additional dielectriclayer and metallization pattern. To form this package structure, aprocess may proceed through the steps discussed above with respect toFIGS. 1 through 3. Then, a second dielectric layer 70 can be formed onthe first dielectric layer 38 and first metallization pattern 40. Thesecond dielectric layer 70 can be a same or similar material and can beformed in a same or similar manner as described above with respect tothe first dielectric layer 38. The second dielectric layer 70 is thenpatterned to form openings to expose portions of the first metallizationpattern 40, such as in a same or similar manner as discussed above withrespect to the first dielectric layer 38. A second metallization pattern72 with vias 74 is formed on the second dielectric layer 70 and in theopenings through the second dielectric layer 70, such as with a same orsimilar material and in a same or similar manner as described above withrespect to the first metallization pattern 40 and vias 42. The vias 74electrically couple the first metallization pattern 40 to the secondmetallization pattern 72. The process may then proceed as discussedabove with respect to FIGS. 4 through 14, where the second dielectriclayer 44 and the third dielectric layer 62 correspond to a thirddielectric layer 76 and a fourth dielectric layer 78, respectively, inFIG. 15.

FIG. 16 illustrates a further cross-sectional view of a packagestructure in accordance with some embodiments. In the embodimentdepicted in FIG. 16, the redistribution structure comprises additionaldielectric layers and metallization patterns. To form this packagestructure, a process may proceed through the steps discussed above withrespect to FIGS. 1 through 3. Then, a second dielectric layer 70 can beformed on the first dielectric layer 38 and first metallization pattern40. The second dielectric layer 70 can be a same or similar material andcan be formed in a same or similar manner as described above withrespect to the first dielectric layer 38. The second dielectric layer 70is then patterned to form openings to expose portions of the firstmetallization pattern 40, such as in a same or similar manner asdiscussed above with respect to the first dielectric layer 38. A secondmetallization pattern 72 with vias 74 is formed on the second dielectriclayer 70 and in the openings through the second dielectric layer 70,such as with a same or similar material and in a same or similar manneras described above with respect to the first metallization pattern 40and vias 42. The vias 74 electrically couple the first metallizationpattern 40 to the second metallization pattern 72.

Then, a third dielectric layer 80 can be formed on the second dielectriclayer 70 and second metallization pattern 72. The third dielectric layer80 can be a same or similar material and can be formed in a same orsimilar manner as described above with respect to the first dielectriclayer 38. The third dielectric layer 80 is then patterned to formopenings to expose portions of the second metallization pattern 72, suchas in a same or similar manner as discussed above with respect to thefirst dielectric layer 38. A third metallization pattern 82 with vias 84is formed on the third dielectric layer 80 and in the openings throughthe third dielectric layer 80, such as with a same or similar materialand in a same or similar manner as described above with respect to thefirst metallization pattern 40 and vias 42. The vias 84 electricallycouple the second metallization pattern 72 to the third metallizationpattern 82. The process may then proceed as discussed above with respectto FIGS. 4 through 14, where the second dielectric layer 44 and thethird dielectric layer 62 correspond to a fourth dielectric layer 86 anda fifth dielectric layer 88, respectively, in FIG. 16.

Embodiments can achieve advantages. By forming an adhesion layer 60 onthe UBMs 56 and upper metallization pattern 58, the third dielectriclayer 62 may have increased adhesion to the UBMs 56 and uppermetallization pattern 58, which may in turn reduce delamination of thethird dielectric layer 62. Further, by having sloped sidewalls of theUBMs 56 and upper metallization pattern 58, more surface area may beavailable to which the third dielectric layer 62 may adhere, which mayfurther reduce delamination. Also, the sloped sidewalls of the UBMs 56may reduce a hump or other build-up of the third dielectric layer 62 onthe UBMs 56, such as when the third dielectric layer 62 is PBO oranother polymer layer. This may improve uniformity of the thirddielectric layer 62, which may improve reliability of the package.

A first embodiment is a package structure. The package structurecomprises an integrated circuit die, an encapsulant at least laterallyencapsulating the integrated circuit die, a redistribution structure onthe integrated circuit die and the encapsulant, a connector supportmetallization coupled to the redistribution structure, and an externalconnector on the connector support metallization. The redistributionstructure comprises a first dielectric layer disposed distally from theencapsulant and the integrated circuit die. The connector supportmetallization has a first portion on a first surface of the firstdielectric layer and has a second portion extending in an openingthrough the first dielectric layer. The first portion of the connectorsupport metallization has a sloped sidewall extending in a directionaway from the first surface of the first dielectric layer.

Another embodiment is a package structure. The package structurecomprises a composite structure, a redistribution structure on thecomposite structure, and an under ball metallization (UBM) on theredistribution structure. The composite structure comprises anintegrated circuit die and an encapsulating material at least laterallyencapsulating the integrated circuit die. A first surface of theredistribution structure is distal from the composite structure. The UBMhas a first portion on the first surface. A sidewall of the firstportion forms a non-perpendicular angle with the first surface, and thenon-perpendicular angle is measured internal to the UBM. An adhesionlayer is on the first portion of the UBM. A first dielectric layer is onthe redistribution structure and adjoins the adhesion layer. An externalelectrical connector is disposed through the first dielectric layer andon the UBM.

A further embodiment is a method. The method comprises encapsulating anintegrated circuit die with an encapsulant and forming a redistributionstructure on the integrated circuit die and the encapsulant. Theredistribution structure comprises a metallization pattern and a firstdielectric layer on the metallization pattern. The first dielectriclayer has a first surface distal from the integrated circuit die and theencapsulant. The method further comprises forming an under ballmetallization (UBM) on the redistribution structure. The UBM has a firstportion on the first surface and a second portion disposed in an openingthrough the first dielectric layer to the metallization pattern. Thefirst portion of the UBM has a sidewall surface that isnon-perpendicular to the first surface of the first dielectric layer.The method further comprises forming a second dielectric layer on thefirst surface of the first dielectric layer and the first portion of theUBM and forming an external electrical connector through an openingthrough the second dielectric layer to the UBM.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A package structure comprising: an integratedcircuit die; an encapsulant at least laterally encapsulating theintegrated circuit die; a redistribution structure on the integratedcircuit die and the encapsulant, the redistribution structure comprisinga first dielectric layer disposed distally from the encapsulant and theintegrated circuit die; a connector support metallization coupled to theredistribution structure, the connector support metallization having afirst portion on a first surface of the first dielectric layer andhaving a second portion extending in an opening through the firstdielectric layer, the first portion of the connector supportmetallization having a sloped sidewall outside of the opening andextending in a direction away from the first surface of the firstdielectric layer, wherein the sloped sidewall has a first point locateda first distance away from the integrated circuit die and a second pointlocated a second distance away from the integrated circuit die, thesecond distance being larger than the first distance and wherein thefirst point is located further from a center of the opening than thesecond point; a seed layer located between the connector supportmetallization and the redistribution structure, wherein the seed layerhas a second sidewall adjacent to the first sidewall, the secondsidewall being perpendicular to the first surface; and an externalconnector on the connector support metallization, wherein each point ofa surface of the connector support metallization is in physical contactwith either a passivation layer or the external connector, the surfacefacing away from the integrated circuit die and extending from a firstside of the connector support metallization to a second side of theconnector support metallization opposite the first side.
 2. The packageof claim 1 further comprising: an adhesion layer on at least part of thefirst portion of the connector support metallization; and a seconddielectric layer on the first dielectric layer and the adhesion layer,the external connector being disposed through an opening through thesecond dielectric layer.
 3. The package structure of claim 2, whereinthe connector support metallization comprises copper, and the adhesionlayer is copper oxide.
 4. The package structure of claim 2, wherein theexternal connector is directly coupled to the connector supportmetallization.
 5. The package structure of claim 1, wherein an angleformed by the sloped sidewall and the first surface is in a range from60 degrees to 85 degrees measured internally to the connector supportmetallization.
 6. The package structure of claim 1, wherein theredistribution structure further comprises a metallization pattern, thefirst dielectric layer being on the metallization pattern, the connectorsupport metallization being mechanically and electrically coupled to themetallization pattern.
 7. A package structure comprising: a compositestructure comprising an integrated circuit die and an encapsulatingmaterial at least laterally encapsulating the integrated circuit die; aredistribution structure on the composite structure, a first surface ofthe redistribution structure being a dielectric material and distal fromthe composite structure; an under ball metallization (UBM) on theredistribution structure and extending into an opening through thedielectric, the UBM having a first portion on the first surface, thefirst portion comprising a first sidewall located outside of the openingthrough the dielectric, the first sidewall facing away from thedielectric material and having a non-perpendicular angle with the firstsurface, the non-perpendicular angle being measured internal to the UBM;an adhesion layer on the first portion of the UBM; a seed layer locatedbetween the UBM and the redistribution structure, wherein the seed layerhas a second sidewall adjacent to the first sidewall, the secondsidewall being perpendicular to the first surface; a first dielectriclayer on the redistribution structure and adjoining the adhesion layer;and an external electrical connector disposed through the firstdielectric layer and on the UBM.
 8. The package structure of claim 7,wherein the non-perpendicular angle is in a range from 60 degrees to 85degrees.
 9. The package structure of claim 7, wherein the externalelectrical connector directly couples the UBM.
 10. The package structureof claim 7, wherein the external electrical connector is a solder ball.11. The package structure of claim 7, wherein the redistributionstructure comprises a metallization pattern and a second dielectriclayer on the metallization pattern, the first surface of theredistribution structure being a surface of the second dielectric layer,the UBM further having a second portion disposed in an opening throughthe second dielectric layer to the metallization pattern.
 12. Thepackage structure of claim 7, wherein the UBM comprises copper, and theadhesion layer comprises copper oxide.
 13. A package structurecomprising: an encapsulant at least laterally encapsulating asemiconductor die; a first metallization layer in electrical connectionwith the semiconductor die and extending over the encapsulant; anunderbump metallization in electrical connection with the firstmetallization layer, wherein the underbump metallization has a firstsidewall that is diagonal to a major surface of the semiconductor die,wherein the first sidewall gets closer to a center of the underbumpmetallization as it moves further away from the semiconductor die,wherein the first sidewall is located over a portion of the encapsulantthat is at least laterally encapsulating the semiconductor die; a seedlayer located between the underbump metallization and the firstmetallization layer, wherein the seed layer has a second sidewalladjacent to the first sidewall, the second sidewall being perpendicularto the major surface; an external connector in physical contact with theunderbump metallization; and a passivation layer, wherein thepassivation layer covers each surface of the underbump metallizationthat is not covered by the external connector and not facing towards thesemiconductor die.
 14. The package structure of claim 13, furthercomprising a seed layer located between the underbump metallization andthe first metallization layer.
 15. The package structure of claim 13,further comprising a second metallization layer electrically connectingthe first metallization layer to the underbump metallization, whereinthe second metallization layer is located between the underbumpmetallization and the first metallization layer.
 16. The packagestructure of claim 15, further comprising a third metallization layerelectrically connecting the second metallization layer to the underbumpmetallization, wherein the third metallization layer is located betweenthe underbump metallization and the second metallization layer.
 17. Thepackage structure of claim 13, wherein the first sidewall is at an angleof between about 60° and about 85°.
 18. The package structure of claim13, further comprising an adhesion layer located on an exterior surfaceof the underbump metallization.
 19. The package structure of claim 18,further comprising a dielectric layer covering at least a portion of theadhesion layer.
 20. The package structure of claim 13, furthercomprising a dielectric layer located between the encapsulant and thefirst metallization layer.